职位&公司对比

职位详情

• 杭州
• 3-5年
• 硕士

• 热传导
• 硬件开发

Job Description Experienced Design Engineer to work in HW product development programs. Primary responsibilities willboss include: - Takes responsibility for the specification and testing of thermal area. - Thermal solution design & implementation of System products according to the Requirement Specification and internal/external standards. - Integration, verification and tesbosst reporting of the product on the module/un直聘it level. - Responsible for quality of all the deliverables within schedule & cost budget. - Coordinates activities within factory and supplier for project successful. Requirements - MSc (BSc) University degree in Mechanics Engineering, fluid mechanics or other similar major; 5 years working experience in thermal design area. - Fluent written and spoken English. - In-depth knowledge about heatsink, TIM, fan and mechanical. - Deep understanding of heat transfer, fluid mechanics and CFD theory. - Experience in electro-mechanics product development. - Skilled for thermal simul直聘ation tool experience, FlothermXT (not flotherm) and Icepak preferred - Good technology knowledge of telecom product plus. - Good understanding of HW development process.